Notes 04 04 19

OSF ready badge and definition: Announce OSF ready badge at March 2020 OCP summit: you are able to install your own build or some companies builds of OSF on it w/o having to go back to the ODM to get your stuff signed.

OCP badge will require OSF ready maybe a year after the announcement. One goal is by the Open Source Firmware conference in Sept’ 2019, Intel will be ready to announce that the licensing on those binary blobs are fixed. Intel Issac shared the document with more details.

LinuxBoot workstream: Facebook, Google, Amazon will have FSP in coreboot, by March 2020 OCP summit will have a deployable FSP in coreboot so people can do LinuxBoot.

Request to Wiwynn on OCP HW for development: Wiwynn Jackie: Wiwynn is preparing both OCP Olympus 1U and Tioga Pass server as OSF development platforms, both Olympus and Tioga Pass require its dedicated rack for power supply hence our development platform will include an extra power conversion kit to power on the system. It will take some time and we’ll soon make it and update the milestone again.

Silicon vendors boot-up flow: Waiting for ARM's response to give us more information on how ARM does the initialization something like FSP. Need to bring AMD in to have all the major three vendors' boot flows. Collaborative community development model : (Reference page 6 in the slides https://www.opencompute.org/files/2018OCP-OSF-OpenEDKII-Workstream.pdf )

The LinuxBoot and Open EDK II will be parallel, the common underlying thing is still the silicon vendors will have to support both worlds, but there will be no common module that interplays between both environments ("HW platform code" module can be removed).